3DIC Technology Forum
半导体制造 2011-10-10 10:55:00
Nowadays, electronic products are becoming shorter, smaller, thinner, and lighter. To meet these requiremnts, we need to scale down the wafer size according to Moore’s Law. However, as the scale of the chip size shrinks, Moore’s Law has reached its limit, What shall we do beyond Moore’s Law? SEMI China will hold a forum to discuss the solution of 3D Integration and and analyze the market trend of this technology.